B.E. (Production Engineering)
ADVANCED MATERIAL PROCESSING
(Sem. – II) (Elective – II) (2003 Course) (411090)
Time : 3 Hours Max. Marks : 100
Instructions to the candidates:
1) Answer three questions from Section – I and Section – II.
2) Answer to the sections should be written in separate books.
3) Neat diagrams must be drawn wherever necessary.
a) Explain with neat sketch oscillating turning process and compare it with conventional turning process.
b) Explain Cryogrinding process. State its advantages.
a) Explain the chip formation mechanism in High speed machining. State advantages of High speed machining.
b) Explain the development of tool material used in advanced machining process.
a) State the requirement of tool material used in EDM? Explain the taper and overcut in EDM.
b) Explain with neat sketch STEM process.
a) For a Rc Ckt adjusted for maximum power supply, following details available, Resistance R = 300 Ohm, Capacitance C = 50 microfarad, Supply voltage = 80 V. Calculate charging current, at the Instant when the CKT is switch on, frequency of discharge.
b) Explain with neat sketches the defects seen in product if it machined by chemical machining.
a) Compare Hot forging, cold forging, and warm forging.
b) Explain with diagram a precision forging process and write its advantages.
a) Explain the procedure for preparation of a blank for three roll forming process.
b) Explain with diagram magneto forming process and write its advantages.
SECTION – II
a) Explain with suitable example how brass components are casted.
b) Explain with neat sketch a continuous casting process.
a) Explain suitable process for casting of Al and Al alloys.
b) State and explain controlling parameters in injection casting process?
a) Suggest suitable process and explain for casting of ceramic parts.
b) What is meant by mushy materials? Explain the processing of such materials.
a) Explain with neat sketch rotational moulding process and state its application, advantages.
b) Suggest and explain a suitable process for following :
i) Packaging film
a) Explain PVD process. Compare it with CVD process.
b) Explain steps in MEMS.
Write notes on following :
i) LIGA process.
ii) Types of Paints
iii) Surface cleaning methods.